Home Technology MediaTek unveils flagship Dimensity 1100 and 1200 5G chips

MediaTek unveils flagship Dimensity 1100 and 1200 5G chips

by Hardik Masani
MediaTek unveils flagship Dimensity 1100 and 1200 5G chips

When talking of SoCs a few years back, you would normally go with the offerings from Qualcomm Snapdragon, Samsung Exynos, and Huawei HiSilicon Kirin, for the most part. MediaTek was part of the flagship conversation years ago with its Helio X series, but still, it lagged behind those big names. The company tried to make some new adjustments and changes with the new MediaTek Dimensity 1000 launched in November 2019 and followed up with the Dimensity 1000 Plus in May 2020. Now in 2021, the Taiwanese company is back with two top-tier SoCs. Take a look at the all-new MediaTek Dimensity 1200 and MediaTek Dimensity 1100.

MediaTek Dimensity 1200 and Dimensity 1100 : Specifications

SpecificationsDimensity 1200Dimensity 1100
ProcessTSMC 6nmTSMC 6nm
CPU– 1x Cortex-A78 @ 3.0GHz +
– 3x Cortex-A78 @ 2.6GHz +
– 4x Cortex-A55 @ 2.0GHz
– 4x Cortex-A78 @ 2.6GHz +
– 4x Cortex-A55 @ 2.0GHz
GPUARM Mali G77 MC9ARM Mali G77 MC9
Memory– 4x LP4x @ 2133MHz PoP
– 2-lane uFS 3.1
– 4x LP4x @ 2133MHz PoP
– 2-lane uFS 3.1
Camera– 200MP single camera, or
– 32MP + 16MP dual camera
– 108MP single camera, or
– 32MP + 16MP dual camera
AIAPU 3.0 (+10% performance improvement)APU 3.0
Video Decoding4K 60fps, 10-bit, AV14K 60fps, 10-bit, AV1
Video Encoding4K 60fps, 10-bit4K 60fps, 10-bit
Display– QHD+ @ 90Hz, or
– FHD+ @ 168Hz
– QHD+ @ 90Hz, or
– FHD+ @ 144Hz
Connectivity– Wi-Fi 6
– GNSS L1 + L5
– Bluetooth 5.2
– Wi-Fi 6
– GNSS L1 + L5
– Bluetooth 5.2
Modem– Sub-6GHz 2CC
– 5G + 5G DSDS
– Sub-6GHz 2CC
– 5G + 5G DSDS
Comparision between MediaTek Dimensity 1200 and Dimensity 1100

The MediaTek Dimensity 1100 and Dimensity 1200 pick off right from where the Dimensity 1000 Plus left, giving us updated options at the top end. While it still is not considered at the top of the helm in the world of smartphone SoCs, these two premium SoCs are quite a good fit for devices in the upper mid-range, if not the flagships.

Performance

Both, the chips feature an octa-core SoC, but there is still a slight difference between them. The higher-end 1200 features a so-called “prime” Cortex-A78 clocked up to 3GHz, while the other three performance cores are Cortex-A78 cores clocked up to 2.6GHz. On the other hand, the Dimensity 1100 features four of these performance cores, instead of a 1x prime + 3x performance setup. While the other four cores on both of these SoCs are Cortex-A55 clocked at up to 2.0GHz. Talking about the GPU, both come with a nine-core ARM Mali-G77 GPU, supporting MediaTek’s HyperEngine 3.0 gaming technologies. This also includes 5G call and data concurrency support, and also a multi-touch boost for increased touchscreen responsiveness. The complete combination also allows support for ray tracing in games and AR apps, as well as super hotspot power savings.

Build Design and Connectivity

MediaTek unveils flagship Dimensity 1100 and 1200 5G chips

For starters, it gets an upgrade from the previous-gen 7nm process from the Dimensity 1000 Plus, as both of these new chips are fabricated on TSMC’s 6nm process. Both chips will feature an integrated 5G modem that supports 5G NSA and SA modes, 5G carrier aggregation (2cc) across FDD and TDD, Dynamic Spectrum Sharing (DSS), Dual SIM Dual Standby 5G, and VoNR support. For a more reliable 5G connection across networks, there is also a 5G HSR mode and 5G Elevator mode. Also, both of them also support Bluetooth 5.2, alongside ultra-low latency true wireless stereo audio and LC3 encoding for higher-quality and lower latency streaming for music on TWS earbuds.

Camera Support

With the Dimensity 1200, it gets a Penta-core ISP on the SoC which supports up to 200MP image sensors (single), and up to 32MP + 16MP image sensors (dual). It also comes in handy as it boasts of staggered 4K HDR video capture for greater dynamic range. On the other hand, the Dimensity 1100’s Penta-core ISP supports up to 108MP image sensors (single), and up to 32MP + 16MP image sensors (dual). Both of them will support AI camera features such as AI Panorama Night Shot, HDR capabilities, AI Noise Reduction, AI Multi-Person Bokeh, and AI-enhanced video playback features such as AI SDR-to-HDR.

Availability

The first devices with the new MediaTek Dimensity 1100 and Dimensity 1200 chips are expected to hit the market at the end of Q1 2021. MediaTek says that a number of big-tech Android manufacturers including Xiaomi, Vivo, OPPO, and Realme have “expressed support” for the new Dimensity chips, suggesting new phones with the SoCs may be imminent. So we can expect some exciting smartphones in the mid and upper-mid ranges.

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